| 摘要 |
The thermoplastic molding compound contains a) 30 to 95 wt.% of at least one aliphatic polyamide or copolyamide as component A, b) 1 to 30 wt.% of at least one cyclic phenoxyphosphazene with at least 3 phenoxyphosphazene units as component B, c) 1 to 15 wt.% of red phosphor as component C, d) 0.1 to 20 wt.% of at least one impact-modified polymer as component D, e) 0 to 50 wt.% of glass fibers as component E, and f) 0 to 30 wt.% of additional additives as component F, wherein the sum of components A to F equals 100 wt.%. |
