发明名称 MOLDING PACKAGING MATERIAL AND BATTERY CASE
摘要 Provided is a molding packaging material that can have an increased use life, can suppress a decrease over time in inter-layer lamination strength, and can have superior molding properties in extrusion molding, draw forming, and the like. The laminate molding packaging material contains: an outside substrate layer (2) comprising a heat resistant resin; an inside sealant layer (3) comprising a thermoplastic resin; and a metal foil provided between the two layers as a barrier layer (4). A matte coat layer (6) comprising a heat resistant resin coating film containing a dispersion of inorganic or organic solid microparticles is formed on the outer surface of the outside substrate layer (2), and the gloss value of the surface thereof is suppressed to no greater than 30%.
申请公布号 KR20140007932(A) 申请公布日期 2014.01.20
申请号 KR20137025535 申请日期 2012.03.29
申请人 SHOWA DENKO PACKAGING CO. 发明人 KURAMOTO TETSUNOBU;MINAMIBORI YUUJI
分类号 B32B15/08;B65D65/40;H01M2/02 主分类号 B32B15/08
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