Method for processing substrate for protection of anti-reflecting layer during manufacturing of imaging device, involves forming amorphous carbon layer on top of to-be protected part formed from anti-reflecting layer of substrate

摘要

The method involves forming a amorphous carbon layer (CA) on top of a to-be protected part formed from a optical layer such as anti-reflecting layer (AR) of a substrate or optical filter layer, where the amorphous layer has thickness ranging between 50 and 500 nanometers. The amorphous layer is removed by providing exposure to an application of constant oxygen plasma of the amorphous carbon layer, prior to cutting of the substrate. A support (GS) i.e. glass, is intended to be assembled on an imaging device.