发明名称 Cooling structure of chip sensor
摘要 PURPOSE: A cooling structure of a component recognition device is provided to maintain the accuracy of component recognition by arranging a structure which maximizes the cooling efficiency of a light source. CONSTITUTION: A substrate(120) forms a plurality of via holes. A light source(110) is installed in a fixed or grounded state through a combining hole. A heat-releasing structure(130) executes the role of heat radiation and a supporter which fixes the substrate and a heat sink(140). The heat sink is arranged in the rear side of the substrate and emits heat. The fan emits or inhales air in order to release heat of the substrate and the light source. A ring-shaped spacer is arranged with surrounding the outer of the light source in order to enable air to pass through between each light source.
申请公布号 KR101352580(B1) 申请公布日期 2014.01.17
申请号 KR20080097271 申请日期 2008.10.02
申请人 发明人
分类号 H01L33/64;H05K7/20;H05K13/04 主分类号 H01L33/64
代理机构 代理人
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