发明名称 HEAD ASSEMBLY OF CHIP MOUNTER AND METHOD FOR ADSORBING CHIP AND MOUNTING CHIP OF HEAD ASSEMBLY USING THE SAME
摘要 PURPOSE: A head assembly of a chip mounter and a method for absorbing and mounting the head assembly using the same are provided to absorb and mount components regardless of an interval between feeders by controlling the interval between nozzle spindles. CONSTITUTION: A rotation bracket(120) is rotatably installed in a head frame(110). A first driver(130) rotates the rotation bracket. First and second spindle brackets(140) are movably installed in both ends of the rotation bracket. The first and second spindle brackets move by a linear motor. First and second nozzle spindles(150) are installed in the first and second spindle brackets. A second driver(160) rotates the first and second nozzle spindles.
申请公布号 KR101352571(B1) 申请公布日期 2014.01.17
申请号 KR20080063999 申请日期 2008.07.02
申请人 发明人
分类号 H05K13/04 主分类号 H05K13/04
代理机构 代理人
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