| 摘要 |
<p>A mould assembly with a heating device comprises: an upper mould with an upper joint surface, a lower mould, two conductive plates and two conductive wires. The lower mould includes a conductive layer, a lower joint surface which is formed on the conductive layer and faces the upper joint surface, an insulating surface which is formed on the conductive layer and faces in an opposite direction from the lower joint surface, an insulating formed on the insulating surface. The two conductive plates are disposed on the conductive layer of the lower mould. The two conductive wires are connected to the conductive plates and each have a resistivity lower than a resistivity of the conductive layer. The mould assembly with a heating device is low cost and capable of making the temperature distribution on the surface of the mould assembly more uniform.</p> |
