发明名称 MEMS STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a technique capable of preventing the occurrence of warp such as the distal end of the movable unit flipping up and the concentration of stress at the movable unit or the coupling unit, which are caused from the release of residual strain of a stacked substrate in an MEMS structure formed in the stacked substrate in which linear expansion coefficients of adjacent layers are different.SOLUTION: The present specification discloses an MEMS structure. The MEMS structure includes a substrate unit formed in a first layer; an intermediate fixing unit formed in a second layer, and an upper fixing unit, a coupling unit, and a movable unit formed in a third layer, where the upper fixing unit is fixed to the substrate unit by way of the intermediate fixing unit, the movable unit is cantilever supported by the coupling unit, and the coupling unit is supported by the upper fixing unit. In the MEMS structure, the coupling unit is connected to the upper fixing unit at a position distant from the distal end of the movable unit than an end of the intermediate fixing unit closer to the distal end of the movable unit with respect to a supporting direction of the movable unit.
申请公布号 JP2014004676(A) 申请公布日期 2014.01.16
申请号 JP20120282404 申请日期 2012.12.26
申请人 TOYOTA CENTRAL R&D LABS INC;TOYOTA MOTOR CORP 发明人 OMURA YOSHITERU;FUJIYOSHI MOTOHIRO;NONOMURA YUTAKA;AKASHI TERUHISA;FUNAHASHI HIROFUMI;HATA YOSHIYUKI;NAKAYAMA TAKAHIRO
分类号 B81B3/00;G01C19/5755;G01P15/125;G02B26/08 主分类号 B81B3/00
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