摘要 |
PROBLEM TO BE SOLVED: To provide a technique capable of preventing the occurrence of warp such as the distal end of the movable unit flipping up and the concentration of stress at the movable unit or the coupling unit, which are caused from the release of residual strain of a stacked substrate in an MEMS structure formed in the stacked substrate in which linear expansion coefficients of adjacent layers are different.SOLUTION: The present specification discloses an MEMS structure. The MEMS structure includes a substrate unit formed in a first layer; an intermediate fixing unit formed in a second layer, and an upper fixing unit, a coupling unit, and a movable unit formed in a third layer, where the upper fixing unit is fixed to the substrate unit by way of the intermediate fixing unit, the movable unit is cantilever supported by the coupling unit, and the coupling unit is supported by the upper fixing unit. In the MEMS structure, the coupling unit is connected to the upper fixing unit at a position distant from the distal end of the movable unit than an end of the intermediate fixing unit closer to the distal end of the movable unit with respect to a supporting direction of the movable unit. |