发明名称 Multi-Band/Multi-Mode Power Amplifier with Signal Path Hardware Sharing
摘要 Existing multi-band/multi-mode (MB/MM) power amplifiers (PAs) use separate signal paths for the different covered frequency bands. This results in a large degree of hardware duplication and to a large die size and cost. Solutions that achieve hardware sharing between the different signal paths of MB/MM PAs are shown. Such sharing includes bias circuit and bypass capacitors sharing, as well as sharing front-end stages and the output stage of the PA. Signal multiplexing may be realized in the transmitter or at the PA front-end while the signal de-multiplexing can be realized either in the PA output stage or at the front-end of the output stage. Such circuits can be applied with saturated and linear MB/MM PAs with adjacent or non-adjacent bands.
申请公布号 US2014015603(A1) 申请公布日期 2014.01.16
申请号 US201213551473 申请日期 2012.07.17
申请人 SCOTT BAKER;MAXIM GEORGE;AMALFI SEMICONDUCTOR, INC. 发明人 SCOTT BAKER;MAXIM GEORGE
分类号 H03F3/20;H03F3/68 主分类号 H03F3/20
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