| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition that can achieve a low dielectric loss tangent of a cured product of the resin composition, and can suppress a smear in a via hole after the cured product having undergone perforation processing and then roughening treatment.SOLUTION: Provided is a specific resin composition containing an epoxide resin, an active ester compound and a smear suppression component. |
