| 摘要 |
PROBLEM TO BE SOLVED: To improve connection strength of wire bonding.SOLUTION: The pressure sensor device comprises: a housing which has a first pressure introduction passage, a second pressure introduction passage, and a connector part; a first pressure detection element which is provided in the housing and detects pressure introduced from the first pressure introduction passage; and a second pressure detection element which is provided in the housing and detects pressure introduced from the second pressure introduction passage. In the housing, on the upper side of the first and second pressure detection elements, a base member and a circuit board are provided. The base member bonds and holds the circuit board with an adhesive. The housing has a holding part for mounting the base member, on the upper side of the first and second pressure detection elements. The base member is bonded and fixed to the holding part of the housing with an adhesive. |
