| 摘要 |
The invention relates to an assembly comprising: a first and a second ceramic body (1, 2) connected by means of a joint that has an active hard solder (5), said active hard solder (5), when averaged over a cohesive main volume comprising at least 50% of the volume of the joint, has an average composition CH with a liquidus temperature TI(CH). According to the invention, a border region of the joint, said region touching at least one of the ceramic bodies (1, 2), has an average composition CR with a liquidus temperature TI(CR), said temperature lying no less than 20 K, preferably no less than 50 K, and especially preferably no less than 100 K above the liquidus temperature TI(CH) of the average composition CH of the main volume. |
