| 摘要 |
A method of manufacturing a subfloor component, comprises: providing a mold configured to form an insulating foam panel, and including pedestal-forming structures for forming the panel to have, in cross-section, a plurality of pedestals with walls that extend into the panel from a first face toward a second opposing face; placing a moisture-resistant film into the mold adjacent to the pedestal-forming structures; placing heat-expandable beads into the mold against the moisture-resistant film opposite the pedestal-forming structures; applying heat to the mold to expand the heat-expandable beads to form the panel, wherein the expansion of the heat-expandable beads causes both the film and the expanding beads to enter into and conform to the pedestal-forming structures thereby to form the pedestals of the panel with the moisture-resistant film fused thereto; removing the panel with the fused moisture-resistant film from the mold; and attaching a hardboard layer to the second face. |
