发明名称 |
RESIN COMPOSITION, AND PRINTED WIRING BOARD, LAMINATED SHEET, AND PREPREG USING SAME |
摘要 |
Disclosed are a resin composition containing (a) a maleimide compound having at least two N-substituted maleimide groups in a molecular structure and (b) a silicone compound having at least one reactive organic group in a molecular structure thereof; and a prepreg using the same, a laminate, and a printed wiring board. A resin composition having excellent heat resistance and low thermal expansion properties; and a prepreg, a laminate, and a printed wiring board using the same can be provided. |
申请公布号 |
KR20140006826(A) |
申请公布日期 |
2014.01.16 |
申请号 |
KR20137018827 |
申请日期 |
2012.01.17 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
MIYATAKE MASATO;KOTAKE TOMOHIKO;NAGAI SHUNSUKE;HASHIMOTO SHINTARO;INOUE YASUO;TAKANEZAWA SHIN;MURAI HIKARI |
分类号 |
C08L83/04;C08G59/40;C08J5/24;C08K3/00;C08K5/18;C08K5/3415;C08K5/3445;C08L63/00;C08L79/04;H05K1/03 |
主分类号 |
C08L83/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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