| 摘要 |
Disclosed herein is a plating apparatus, including: a plating tank receiving a plating solution and having an article to be plated injected thereinto; an anode disposed to face one surface or both surfaces of the article to be plated; and a shielding member disposed between the article to be plated and the anode and configured of a first plate and a second plate adjacently disposed to the first plate, the first plate and the second plate moving in parallel with each other. |
