The present invention relates to a bending test device for a film which can test the soldering durability of a flexible printed circuit board film. According to an embodiment of the preset invention, the bending test device for a film comprises: a body having a curved surface; an arm having one end arranged on the body to rotate around a rotary axis in parallel to a central axis of the curved surface, and the other end extended in parallel to the radial direction of the curved surface; a driving part for rotating back and forth the arm on one end of the arm coupled to the body; and a clip part for fixing one end of the film on the body and the other end of the film on the other end of the arm. In the bending test device for a film, the film having both ends fixed by the clip part is curved along the curved surface of the body while being in contact with the curved surface of the body by the rotation of the arm. [Reference numerals] (160) Control part; (170) Counter
申请公布号
KR101349789(B1)
申请公布日期
2014.01.16
申请号
KR20120089787
申请日期
2012.08.17
申请人
KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
发明人
KO, YONG HO;BANG, JUNG HWAN;LEE, CHANG WOO;KIM, JUN KI;YOO, SE HOON;KIM, MIN SU;KANG, MYUNG SUK