发明名称 TESTING DEVICE FOR BENDING FPCB
摘要 The present invention relates to a bending test device for a film which can test the soldering durability of a flexible printed circuit board film. According to an embodiment of the preset invention, the bending test device for a film comprises: a body having a curved surface; an arm having one end arranged on the body to rotate around a rotary axis in parallel to a central axis of the curved surface, and the other end extended in parallel to the radial direction of the curved surface; a driving part for rotating back and forth the arm on one end of the arm coupled to the body; and a clip part for fixing one end of the film on the body and the other end of the film on the other end of the arm. In the bending test device for a film, the film having both ends fixed by the clip part is curved along the curved surface of the body while being in contact with the curved surface of the body by the rotation of the arm. [Reference numerals] (160) Control part; (170) Counter
申请公布号 KR101349789(B1) 申请公布日期 2014.01.16
申请号 KR20120089787 申请日期 2012.08.17
申请人 KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY 发明人 KO, YONG HO;BANG, JUNG HWAN;LEE, CHANG WOO;KIM, JUN KI;YOO, SE HOON;KIM, MIN SU;KANG, MYUNG SUK
分类号 G01N3/20;H01L21/66 主分类号 G01N3/20
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