发明名称 SILVER-CONTAINING COMPOSITION AND SILVER COMPONENT FORMING BASE MATERIAL
摘要 <p>Provided are a silver-containing composition exhibiting high storage stability and a silver component forming base material using the composition, according to which a silver component such as a metal silver film or wire which exhibits excellent conductivity and adhesion can be obtained by sintering at a low temperature of 120°C or below for a short amount of time or sintering at 150°C or higher for an extremely short amount of time. The composition of the present invention comprises a silver compound (A) represented by formula (1), an amine compound (B) represented by formula (2) and a silane coupling agent (C), where the silver compound (A), the amine compound (B) and the silane coupling agent (C) are included at a specific ratio. (R1: hydrogen, -(CY1Y2)a-CH3, or ((CH2)b-O-CHZ)c-CH3, R2: -(CY1Y2)d-CH3, -((CH2)e-O-CHZ)f-CH3, Y1, Y2: hydrogen or -(CH2)g-CH3, Z: hydrogen or -(CH2)h-CH3, a: 0 to 8, b: 1 to 4, c: 1 to 3, d: 0 to 8, e: 1 to 4, f: 1 to 3, g: 0 to 3, h: 0 to 2).</p>
申请公布号 WO2014010549(A1) 申请公布日期 2014.01.16
申请号 WO2013JP68631 申请日期 2013.07.08
申请人 NOF CORPORATION 发明人 NAKAMURA HISASHI;TAGUCHI HIROYUKI;TAKAHASHI SHUICHI
分类号 H01B1/22;C09D1/00;C09D5/24;C09D11/00;H01B5/14 主分类号 H01B1/22
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