THE POGO BLOCK FOR HI-FIX BOARD OF AUTOMATIC TEST EQUIPMENT AND MANUFACTURING METHOD THEREOF

摘要

The present invention relates to a pogo block for a hi-fix board of an automatic test device and, more specifically, comprises; a step (1) of processing a printed circuit board using a drill so that multiple penetration holes are formed on the printed circuit board; a step (2) of filling the penetration holes of the printed circuit board with metal; a step (3) of performing back-drill processing on each penetration hole forming portion of a lower surface of the printed circuit board with predetermined depth and diameter; and a step of pressurizing and inserting a pogo pin placed on one end of a pogo cable into a hole which is formed by the back-drill processing of the step (3). According to a pogo block for a hi-fix board of an automatic test device and a manufacturing method thereof what the present invention is suggesting, the present invention performs drill processing on a printed circuit board using a hole pluging land (HLP) method and charges the whole holes with metal and manufactures a pogo block by performing back-drill processing so that a pogo pin is inserted into a lower surface of the printed circuit board and forms the pogo block having high density and remarkably saves time and manpower than an existing solder method by fixing a cable with pressurizing insertion and easily repairs after manufacture and improves an SI characteristic by shortening a signal route coupled with an interposer at the most. [Reference numerals] (S100) Step of performing the drill processing so that multiple penetration holes are formed on a printed circuit board; (S200) Step of filling a penetration hole of a printed circuit board with metal; (S300) Step of performing the back drill-processing on the penetration hole formation site of the lower surface of the printed circuit board with predetermined depth and diameter; (S400) Step of pressing and inserting a pogo pin included on one end of a pogo cable into a hole formed by the back drill-processing of the step S300