| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding head capable of more rapidly heating and cooling a bonding tool.SOLUTION: A bonding head 6 comprises: a tool base 8 which is installed on a housing 6A and transmits laser light L; and a bonding tool 9 which is installed in contact with the tool base and is heated by the laser light transmitted through the tool base, and is capable of joining a semiconductor chip 3 to a substrate 2 by heating the semiconductor chip 3 using the bonding tool. A recess 41 formed on at least one of a contact surface 9A of the bonding tool 9 and a contact surface 8A of the tool base 8 reduces a contact area between the bonding tool and the tool base. Sine the transmission of heat between the bonding tool 9 and the tool base 8 can be reduced by reducing the contact area, the takt time of a bonding device can be improved by improving heating efficiency and cooling efficiency of the bonding tool 9 as compared with the conventional art. |
