MOUNTING SUBSTRATE, MANUFACTURING METHOD THEREOF AND LED MODULE

摘要

PROBLEM TO BE SOLVED: To provide a mounting substrate, a manufacturing method thereof and an LED module capable of increasing heat dissipation and preventing the substrate from warping.SOLUTION: A mounting substrate 2 includes: a long heat transfer part 20 for mounting plural LED chips on one surface side thereof; and a wiring pattern 22 disposed on the other surface side of the heat transfer part 20. The heat transfer part 20 includes through holes 20b which allows wires to pass therethrough to connect the LED chips and the wiring pattern 22. A first pattern 22a and a second pattern 22b of the wiring pattern 22 are formed in a comb-like shape in a plane view being interposed alternately. The first pattern 22a includes first slits 21ac which are formed to open at one edge side in a first comb-bone portion 22aa opposite to a second comb-bone portion 22ba extending up to a first comb-teeth portion 22ab. The second pattern 22b includes second slits 22bc which are formed to open at one edge side in the second comb-bone portion 22ba opposite to the first comb-bone portion 22aa extending up to a second comb-bone portion 22bb.