| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer printed wiring board capable of reducing a dielectric dissipation factor of an insulating layer and a root mean square roughness Rq of a surface of the insulating layer after roughening treatment despite the fact that smear after roughening treatment in a via hole of the insulating layer can be suppressed.SOLUTION: There is provided a method for manufacturing a printed wiring board including specific steps in which a resin composition containing an epoxy resin, an active ester compound, and an inorganic filler is used. |
