发明名称 RADIATION-HEAT-CONDUCTION-SUPPRESSING SHEET
摘要 PROBLEM TO BE SOLVED: To provide a radiation-heat-conduction-suppressing sheet which makes possible to suppress the rise in the temperature at the surface of a housing and to reduce the occurrence of a heat spot, and which is very easy to attach to the housing.SOLUTION: The radiation-heat-conduction-suppressing sheet has a heat conductive layer, and an adhesive layer having a thickness of 100 μm or smaller. The heat conductive layer has a far-infrared absorption rate of 0.6 or smaller at a wavelength of 7-10 μm, and a heat conductivity of 200 W/m K or larger. In use, the radiation-heat-conduction-suppressing sheet is fixed to a housing having therein an exothermic unit on its heat conduction-suppressing layer side in position so that the heat conductive layer is never put in close contact with the exothermic unit, but is opposed to a heat-radiation face thereof.
申请公布号 JP2014007247(A) 申请公布日期 2014.01.16
申请号 JP20120141185 申请日期 2012.06.22
申请人 NITTO DENKO CORP 发明人 HIRAO AKIRA;HYODO TOMOKI;SOGA MASATSUGU;KAWAMOTO YUSUKE;MAIKAWA HIDETOSHI
分类号 H05K7/20 主分类号 H05K7/20
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