发明名称 METHOD FOR MANUFACTURING ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic device, capable of performing in-line measurement of the film thickness of a conductive film.SOLUTION: A method for manufacturing an electronic device includes the steps of: forming at least one recessed part in at least one insulation film 102; measuring a first film thickness T11 of the insulation film at the bottom face of the recessed part; forming at least one conductive film 104 in the recessed part, the conductive film having an upper face that forms a same face with the upper face of the insulation film; measuring a second film thickness T12 of the insulation film in a region other than the recessed part; and deducting the first film thickness T11 from the second film thickness T12 to calculate a film thickness T13 of the conductive film.
申请公布号 JP2014007183(A) 申请公布日期 2014.01.16
申请号 JP20120139683 申请日期 2012.06.21
申请人 RENESAS ELECTRONICS CORP 发明人 ISHIGURO HISASHI
分类号 H01L21/66;H01L21/3205;H01L21/768;H01L23/522 主分类号 H01L21/66
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