| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer processing method capable of stably holding a wafer in a state in which a gap between chips is kept and easily transferring the wafer to a next step without damaging the chips.SOLUTION: The wafer processing method comprises a modified layer formation step, a grinding step, a tape expanding step, a second annular frame mounting step, and an expand tape cutting step. The modified layer formation step forms a modified layer K by irradiating a wafer W with a laser beam from a rear surface WR of the wafer W. The grinding step divides the wafer W by grinding using the modified layer K as a starting point. The tape expanding step forms a gap G between adjacent chips DT by expanding the expand tape T1 to which the wafer W is stuck by pressing the tape. The second annular frame mounting step sticks an adhesive tape T2 to the expanded expand tape T1 to keep expansion of the expand tape T1. The expand tape cutting step annually cuts an inner side than an opening edge of a first annular frame F1 of the expand tape T1. |
