| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method capable of manufacturing a laminate sheet for non-contact IC cards with good production efficiency while reducing its production cost.SOLUTION: A hot-melt adhesive is applied to the peripheral surface of a rotary cylinder 1 to form a hot-melt coating sheet 6. A continuous inlet film 7 having inlets continuously is cut to prepare inlet single pieces 8. After the inlet single pieces 8 are affixed to the hot-melt coating sheet 6, the hot-melt coating sheet 6 is peeled off. The peeled-off hot-melt coating sheet 6 is overlaid on a top surface of a lower-surface sheet 40, and an upper-surface sheet 50 is overlaid on and affixed to the hot-melt coating sheet 6, thereby preparing a laminate sheet 9 in which the inlet single pieces 8 are held between the lower-surface sheet 40 and the upper-surface sheet 50. |
