| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board where a plating layer is sufficiently deposited on a surface of a conductor provided on an inner surface of each hole.SOLUTION: A wiring board 1 includes: an insulation substrate 11 having a main surface including multiple holes 12; a conductor 13 provided at inner surfaces of the multiple holes 12; and wiring conductors 15 provided on the insulation substrate 11. The multiple holes 12 are provided so as to be vertically or horizontally arranged in a plane view. The insulation substrate 11 has through holes 14, each of which connects the adjacent holes 12 with each other. Since a plating solution is easily circulated in the holes 12, the plating solution easily flows into the holes 12 and a plating layer is sufficiently deposited on the conductor 13 provided on the inner surface of each hole 12. |
