| 摘要 |
PROBLEM TO BE SOLVED: To provide a radio module which achieves space saving in packaging.SOLUTION: A radio module 101 includes: a radio IC chip 300 which processes transmitting and receiving signals; a substrate 200 on which the radio IC chip 300 is mounted; antennas 410, 420 provided on the substrate 200; and multiple terminals 600 extending from the substrate 200 in an in-plane direction of the substrate 200. |
