| 摘要 |
PROBLEM TO BE SOLVED: To provide: a photocurable resin composition that provides a coating in which high film thickness and fine pattern formation, especially contact hole pattern can be easily performed, and even in low temperature postcure, each film characteristic, especially adhesion to a base material used for a circuit board is excellent, and in addition, provides a coating in which reliability as an electric and electronic component, especially chemical resistance to a solder flux liquid is excellent, and reliability is high; further a pattern formation method; and the coating for electric and electronic component protection.SOLUTION: A photocurable resin composition includes: an epoxy group-containing polymer compound that has a repeating unit shown by formula (1) and in which a weight average molecular weight is 3,000-500,000; an onium salt based optical acid generator that has a tetrakis-(pentafluorophenyl) borate anion shown by formula (4); a solvent; and a crosslinking agent comprising an epoxy resin when needed. |
