| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition, which is suitable for many applications, including for power semiconductors, and gives a cured product improved in both thermostability and moisture resistance reliability, while having storage stability and quick curability contributing to improvement in work efficiency.SOLUTION: An epoxy resin composition at least contains a naphthalene type tetrafunctional epoxy resin of the following formula (1), a curing agent, and a phosphorus-based curing accelerator including one or more triarylphosphine triphenylborane adduct. |
