| 摘要 |
PROBLEM TO BE SOLVED: To individually cool chip mounting positions and shrink a substrate prior to a chip thereby preventing deformation, damage, and joining failure of the chip and the substrate, and to prevent the deterioration of the heat efficiency which is caused by cooling the next chip mounting position and shorten the work time of bonding.SOLUTION: The following means is adopted in a bonding device. Firstly, the bonding device includes: a bonding head 3 including chip holding means and heating means and a bonding stage 4 including substrate cooling means. Secondly, multiple chip mounting positions 47 are provided on a substrate 40. Thirdly, chips 7 are sequentially heated while being positioned at the chip mounting positions 47 to be bonded. Fourthly, the chip mounting positions 47 on the substrate 40, which is subject to bonding, are cooled by the substrate cooling means having multiple cooling parts 46 which independently cool the respective chip mounting positions 47. |
