| 摘要 |
A three-dimensional integrated structure is formed from a first integrated circuit with a first cavity filled with a first conductive material and a second integrated circuit with a second cavity filled with a second conductive material, the second cavity facing the first cavity. The filled first cavity forms a first element and the filled second cavity forms a second element, the first and second elements separated from each other by a cavity. The first and second conductive materials have different thermal expansion coefficients. A contact detection circuit is electrically connected to the filled first and second cavities, and is operable to sense electrical contact between the first and second conductive materials in response to a change in temperature. |
