CURABLE ELECTROCONDUCTIVE ADHESIVE COMPOSITION, ELECTROMAGNETIC SHIELDING FILM, ELECTROCONDUCTIVE ADHESIVE FILM, ADHESION METHOD, AND CIRCUIT BOARD

摘要

[Problem] To provide a curable electroconductive adhesive composition with which resin flow can be controlled and embedding properties can be ensured. [Solution] A curable electroconductive adhesive composition containing: (A) a polyurethane resin having at least one functional group selected from the group consisting of carboxyl groups, hydroxyl carbon-carbon unsaturated bonds, and alkoxysilyl groups; (B) an epoxy resin having two or more epoxy groups in the molecule; (C) at least one additive selected from the group consisting of crosslinking agents, polymerization initiators, and tin-based metal catalysts; and (D) an electroconductive filler. A curable electroconductive adhesive composition, characterized by containing: (A') a polyurethane resin having a carboxyl group; (B) an epoxy resin having two or more epoxy groups in the molecule; (C') at least one additive selected from the group consisting of isocyanate compounds, block isocyanate compounds, and oxazoline compounds; and (D) an electroconductive filler.