发明名称 |
SILVER-COATED COPPER ALLOY POWDER AND METHOD FOR PRODUCING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a silver-coated copper alloy powder which has low volume resistivity and excellent storage stability (reliability), and a method for producing the silver-coated copper alloy powder.SOLUTION: A copper alloy powder (preferably a copper alloy powder having a cumulative 50% particle diameter (Ddiameter) measured by a laser diffraction type particle size distribution device of 0.1-15 μm), which has a composition containing at least one of zinc and nickel at 1-50 mass% with the remainder comprising copper and unavoidable impurities, is coated by a layer containing 7-50 mass% of silver, preferably a layer formed of silver or a silver compound. |
申请公布号 |
JP2014005531(A) |
申请公布日期 |
2014.01.16 |
申请号 |
JP20130004185 |
申请日期 |
2013.01.15 |
申请人 |
DOWA ELECTRONICS MATERIALS CO LTD |
发明人 |
INOUE KENICHI;OGI KOZO;EBARA ATSUSHI;HIYAMA YUTO;YAMADA TAKEHIRO;KAMIYAMA TOSHIHIKO |
分类号 |
B22F1/02;B22F1/00;C22C9/00;C22C9/04;C22C9/06;H01B1/00;H01B1/22;H01B5/00;H01B5/14;H01B13/00;H05K3/12 |
主分类号 |
B22F1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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