发明名称 SILVER-COATED COPPER ALLOY POWDER AND METHOD FOR PRODUCING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a silver-coated copper alloy powder which has low volume resistivity and excellent storage stability (reliability), and a method for producing the silver-coated copper alloy powder.SOLUTION: A copper alloy powder (preferably a copper alloy powder having a cumulative 50% particle diameter (Ddiameter) measured by a laser diffraction type particle size distribution device of 0.1-15 μm), which has a composition containing at least one of zinc and nickel at 1-50 mass% with the remainder comprising copper and unavoidable impurities, is coated by a layer containing 7-50 mass% of silver, preferably a layer formed of silver or a silver compound.
申请公布号 JP2014005531(A) 申请公布日期 2014.01.16
申请号 JP20130004185 申请日期 2013.01.15
申请人 DOWA ELECTRONICS MATERIALS CO LTD 发明人 INOUE KENICHI;OGI KOZO;EBARA ATSUSHI;HIYAMA YUTO;YAMADA TAKEHIRO;KAMIYAMA TOSHIHIKO
分类号 B22F1/02;B22F1/00;C22C9/00;C22C9/04;C22C9/06;H01B1/00;H01B1/22;H01B5/00;H01B5/14;H01B13/00;H05K3/12 主分类号 B22F1/02
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