| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic component, capable of reliably removing a functional layer from an electrode within a short time to connect a terminal, and a manufacturing apparatus of the electronic component.SOLUTION: In connecting a terminal to an electrode 2 which includes a functional layer 2a formed on both sides of substrate metal by means of at least one treatment of etching treatment or film formation treatment, a mechanical processing step of removing the functional layer 2a from a region of a part of the electrode 2 by means of mechanical processing and a laser beam irradiation step of irradiating the region, where the functional layer 2a has been removed through the mechanical processing step, with a laser beam L are performed, and in a terminal connection step, the terminal is connected to the region where the laser beam L has been irradiated. |
