| 摘要 |
The light emitting diode module is disclosed. The light emitting diode module includes a ceramic substrate, a circuit layer, at least an illuminant element and a driving circuit element. The ceramic substrate has a recess formed on and upper surface thereof. The circuit layer is placed on the upper surface of the ceramic substrate. The driving circuit element is disposed on the upper surface of the ceramic substrate and electrically connected to the circuit layer. By providing the recess at molding of the ceramic substrate, the light emitting diode module can prevent manufacturing difficulty from hardness ceramic substrate. In addition, by accommodating the adhesive in the recess, the adhesive can be easily orientated and of convex shape. |
