发明名称 METHODS FOR PRODUCING A BOND AND A SEMICONDUCTOR MODULE
摘要 A pressure chamber has first and second housing elements and first and second chamber regions. The pressure chamber is loaded with a first part, a second part, a connecting means and a sealing means. The connecting means is arranged in the first chamber region. The loaded pressure chamber is placed into a receiving region. The first housing element is pressed against the second housing element so that the pressure chamber is clamped with the aid of a working cylinder between the working cylinder and a holding frame. In the clamped state, a second gas pressure, which is higher than a first gas pressure in the first chamber region, is generated in the second chamber region. In this way, the first part, the second part and the connecting means are pressed against one another within the pressure chamber.
申请公布号 US2014013595(A1) 申请公布日期 2014.01.16
申请号 US201313939635 申请日期 2013.07.11
申请人 INFINEON TECHNOLOGIES AG 发明人 HONG TAO
分类号 H01L23/00 主分类号 H01L23/00
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