SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

摘要

PROBLEM TO BE SOLVED: To improve a chip strength and reliability of a semiconductor chip.SOLUTION: A semiconductor device manufacturing method comprises the steps of: preparing a semiconductor wafer 40 which includes a plurality of semiconductor chips 10b arranged in a matrix and has first bump electrodes 17b formed on a first surface of the semiconductor wafer 40; forming recesses 42 for sectioning individual semiconductor chips 10b on the first surface of the semiconductor wafer 40; applying the first surface of the semiconductor wafer 40 to a support tape 102; and dividing the semiconductor wafer 40 into the plurality of semiconductor chips 10b by cutting the semiconductor wafer 40 from the side of a second surface opposite to the first surface of the semiconductor wafer 40 along the recesses 42 with a dicing blade 108 having a width smaller than a width of the recess 42.