| 摘要 |
PROBLEM TO BE SOLVED: To reduce the impedance between a circuit board 10 and a lead frame 20 and make the physical constitution small in an integrated circuit 1.SOLUTION: The integrated circuit 1 includes: electronic components 60, 61a, 61b, 62, 63; a lead frame 20 for electrically connecting a circuit board 10 with the electronic components 60, 61a, ..., 63 and electrically connecting electronic components 11, 12, ..., 63 with an external circuit; and a cover part 40 which covers the electronic components 11, 12, ..., 63 with a mold resin. The electronic components 60, 61a, 61b, 62, 63 are arranged in a direction perpendicular to a plane direction of the circuit board 10. The lead frame 20 is joined to the circuit board 10 by a conductive adhesive 71. This structure reduces the impedance between the lead frame 20 and the circuit board 10. |
