发明名称 METHOD OF WELD OVERLAY FOR COPPER
摘要 PROBLEM TO BE SOLVED: To solve a problem that in welding of copper, for which TIG welding or MIG welding is usually used, and in which shield gas is limited to atomic gas such as Ar and He, an arc voltage and an arc temperature cannot be increased by molecular heat of dissociation of shield gas, and spatter is generated if an attempt is made to compensate for the lack of heat input due to a large heat discharge amount of copper by an increase in an electric current, leading to quality deterioration, so welding has been conducted by increasing the preheat temperature up to about 500°C, imposing a heavy heat load on an operator.SOLUTION: The ways to increase the arc temperature without raising a welding current value are as follows: (1) To apply a mixer for mixing molecular inert gas having a significant temperature rise effect into atomic inert gas such as Ar and He. (2) To apply an electrifying device for electrifying vaporized flux which is produced by mixing mixed inert gas and gaseous flux which is produced by vaporizing liquid flux. (3) To apply a method for imparting rotation to vaporized flux using a welding torch provided with a rotary vane.
申请公布号 JP2014004621(A) 申请公布日期 2014.01.16
申请号 JP20120143871 申请日期 2012.06.27
申请人 HARADA TETSUO 发明人 HARADA TETSUO
分类号 B23K9/16;B01F3/02;B01F5/00;B01F15/00;B23K9/04;B23K9/29 主分类号 B23K9/16
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