| 摘要 |
PROBLEM TO BE SOLVED: To provide a laser processing apparatus and a laser processing method capable of finely processing a workpiece.SOLUTION: A laser processing apparatus 1 includes a laser light source 14 for generating a laser beam, a first objective lens OL1 provided to oppose a workpiece to be processed with the laser beam for concentrating the laser beam on the workpiece, a second objective lens OL2 provided on an optical path of the laser light source 14 and the first objective lens OL1, a displacement mechanism 15 for displacing the second objective lens OL2, and a control unit 11. The control unit 11 performs control to displace the second objective lens OL2 using the displacement mechanism 15, to change a processing position with the laser beam, which is a light concentrating position of the laser beam, from a surface of the workpiece along an optical axis direction of the first objective lens OL1 and irradiate the workpiece with the laser beam. |
