| 摘要 |
<p>Provided is a method for cutting a film-provided glass plate. The interior of a glass plate provided with a thin film on the first primary surface thereof is heated by radiating laser light at the glass plate, and the laser light is caused to scan at the same time. The wavelength of the laser light is 2500-3500 nm, and the laser is radiated from the first primary surface side. By means of such a configuration, a step for eliminating the thin film and a step for inverting the film-provided glass plate become unnecessary, and it is possible to productively cut the film-provided glass plate using laser light.</p> |
