| 摘要 |
According to the embodiment of the present invention, a method for manufacturing a circuit pattern is provided, which includes the steps of: forming a ground member; forming a circuit layer forming a curved structure along a curve of the surface of the ground member on the ground member by attaching a metallic material to the ground member; forming a circuit pattern on the circuit layer with an anti-plating layer by patterning the anti-plating layer after forming the anti-plating layer on the circuit layer; removing the metallic material not coated by the circuit pattern of the anti-plating layer from the ground member by etching the circuit layer, and forming the circuit pattern on the circuit layer; and exposing the circuit layer, where the circuit pattern is formed already, on the ground member by removing the anti-plating layer. Thus, manufacturing costs of the circuit pattern can be reduced and manufacturing quality of the circuit pattern can be improved. [Reference numerals] (AA) START;(BB) END;(S300) Form ground member;(S310) Form circuit layer forming curved structure along curve of surface of ground member, by attaching metal material on ground member;(S330) Form anti-plating layer on circuit layer;(S350) Form circuit pattern on circuit layer with anti-plating layer by patterning anti-plating layer;(S370) Form circuit pattern on circuit layer by removing metal material which is not coated by circuit pattern of anti-plating layer from ground member through etching, by etching circuit layer;(S390) Expose circuit layer which has circuit pattern formed by removing anti-plating layer to surface of ground member |
