Method of producing ciruit board by additive method.

摘要

The present invention relates to a circuit board comprising:
a circuit groove having at least one land region for surface mounting of electronic parts and at least one circuit wiring region formed integrally with the land region, and
a partial reinforcing structure formed in the land region of the circuit groove,
wherein the partial reinforcing structure is at least one structure selected from a group consisting of:
an irregular shape having a ten-point average roughness (Rz) of 0.1 to 20 µm formed on the groove surface in the land region,
a groove shape having the groove depth in the land region larger than that of the circuit wiring region to form a plated film having thickness in the land region thicker than that of the circuit wiring region, and
a structure formed by forming at least one protrusion on the periphery of the groove in the land region.