发明名称 |
POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM USING SAME, PROTECTIVE FILM, INSULATING FILM, SEMICONDUCTOR DEVICE, AND DISPLAY DEVICE |
摘要 |
Disclosed is a positive photosensitive resin composition which can reduce warping of a substrate such as a semiconductor wafer or the like even when the positive photosensitive resin composition is subjected to dehydration ring closing by the application of a thermal history; a cured film; a protecting film; an insulating film; a semiconductor device; and a display device. The positive photosensitive resin composition comprises a polyamide resin mainly composed of a polybenzoxazole precursor and being patterned on the substrate such as a semiconductor wafer or the like by coating, exposure and development. The cured film is obtained by subjecting the positive photosensitive resin composition containing a polyamide resin mainly composed of a polybenzoxazole precursor to dehydration ring closing. The protecting film comprises the cured film. Specifically disclosed is a positive photosensitive resin composition comprises a polyamide resin (A) and a photosensitizing agent (B), wherein the polyamide resin comprises a repeating unit (A-1) represented by the general formula (1), and a repeating unit (A-2) represented by the general formula (2) and/or a repeating unit (A-3) represented by the general formula (3). |
申请公布号 |
EP2397902(A4) |
申请公布日期 |
2014.01.15 |
申请号 |
EP20100741104 |
申请日期 |
2010.02.12 |
申请人 |
SUMITOMO BAKELITE CO., LTD. |
发明人 |
HASEGAWA, MASATOSHI |
分类号 |
G03F7/023;G03F7/075 |
主分类号 |
G03F7/023 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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