| 摘要 |
<p>The present invention relates to an electronic component comprising at least one electrical power loss source (16) arranged in a casting compound (14). According to the invention, a cooling device, preferably at least one thermally conductive part (21) which is arranged with a subregion (22) directly on or at least in the vicinity of the power loss source (16) and with at least one further subregion (23) passes beneath a surface region (20) of the surface (18) of the casting compound (14), is provided in said casting compound (14).</p> |
