发明名称 |
ADHESIVE-BONDED STRUCTURE COMPRISING BOTH ADHESIVE COMPOSITION AND WOOD MATERIAL |
摘要 |
<p>The present invention provides a bonded structure that includes a wood material and a curable composition prepared from a reactive silyl group-containing polymer and that has high strength and boiling water resistance. The reactive silyl group-containing polymer is an environmentally friendly material having less toxicity. The use of a reactive silyl group-containing organic polymer containing a (meth)acrylate polymer and a polyoxyalkylene polymer with specific structures provides a curable composition having high strength and a high modulus, leading to the formation of a bonded structure including the composition and a wood material, which is excellent in strength and boiling water resistance. Thus, the above problem can be solved.</p> |
申请公布号 |
EP2684690(A1) |
申请公布日期 |
2014.01.15 |
申请号 |
EP20120754979 |
申请日期 |
2012.03.07 |
申请人 |
KANEKA CORPORATION |
发明人 |
ITANO, YU;OKAMOTO, TOSHIHIKO |
分类号 |
B32B21/13;B32B27/00;C08G59/50;C08L63/00;C09J133/14;C09J143/04;C09J171/02;C09J183/06 |
主分类号 |
B32B21/13 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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