| 摘要 |
The present invention relates to a box for packaging a semiconductor wafer: which is environmentally friendly and can be recycled; which can package multiple wafers rapidly and conveniently; which has impact resistance in order to prevent damage to the wafer due to external impacts during transportation or storage; and which can perform packaging efficiently, as well as a manufacturing method thereof. The box for packaging a semiconductor wafer comprises: a top open lower box of double wall corrugated paperboard where a first side unit and a second side unit are formed vertically by being integrated with the bottom surface toward the upper part, one side of the first side unit and one side of the second side unit are in contact with each other on the rectangular bottom surface, and a first open unit and a second open unit are formed toward the front part of the first and second side units; a bottom open upper box of double wall corrugated paperboard which is formed in the same way as the lower box, where a third side unit and a fourth side unit are formed vertically by being integrated with an upper cover toward the lower part in order to close the first and second open units in the lower box based on the upper cover corresponding to the bottom surface of the lower box, and where a third open unit and a fourth open unit closed by the first and second side units of the lower box are formed toward the front part of the third and fourth side units; and a box combination fixating unit which is to fixate the upper and lower boxes to each other by inserting the upper box into the lower box through the combination between a groove and a protrusion corresponding to each other when combining the upper box into the lower box. |
