发明名称
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a copper or a copper alloy material which does not require plating using Sn, Ni or the like, can suppress the increase of electric resistance at a joint part to the minimum and facilitates laser welding. <P>SOLUTION: The copper material or copper alloy material for laser welding is characterized in that a conductive coating layer having resistivity 100Ωcm or less is disposed on at least one side of a copper plate or copper alloy plate having a plate thickness of 0.05 to 10.0 mm. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP5391045(B2) 申请公布日期 2014.01.15
申请号 JP20090276757 申请日期 2009.12.04
申请人 发明人
分类号 C23C26/00;B05D7/14;B23K26/18;B23K26/21 主分类号 C23C26/00
代理机构 代理人
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