| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of cutting a silicon ingot capable of cutting the silicon ingot with a fixed grain wire, without fail, and to reduce the cost required for the fixed grain wire. SOLUTION: The method of cutting silicon ingot includes a first cutting step for cutting a plurality of silicon ingots 20 with a diameter of 150 mm or more and a second cutting step for cutting the plurality of silicon ingots 21 with a diameter L2 smaller than that of the silicon ingots 20, in the first cutting step by reusing the wire 11 used in the first cutting step and making the feeding rate of the wire 11 higher than that in the first cutting step. COPYRIGHT: (C)2011,JPO&INPIT |
