发明名称 |
THERMOSETTING RESIN COMPOSITION AND PREPREG AND LAMINATE BOTH MADE WITH THE SAME |
摘要 |
The present invention provides a thermosetting resin composition comprising (A) a metal salt of disubstituted phosphinic acid, (B) a maleimide compound having a N-substituted maleimide group in a molecule, (C) a 6-substituted guanamine compound or dicyandiamide and (D) an epoxy resin having at least two epoxy groups in a molecule and a prepreg and a laminated plate which are prepared by using the same. The prepregs obtained by impregnating or coating a base material with the thermosetting resin compositions of the present invention and the laminated plates produced by laminating and molding the above prepregs are balanced in all of a copper foil adhesive property, a glass transition temperature, a solder heat resistance, a moisture absorption, a flame resistance, a relative dielectric constant and a dielectric loss tangent, and they are useful as a printed wiring board for electronic instruments. |
申请公布号 |
EP2226349(B1) |
申请公布日期 |
2014.01.15 |
申请号 |
EP20080777412 |
申请日期 |
2008.06.19 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
TSUCHIKAWA, SHINJI;AKIYAMA, MASANORI;KOTAKE, TOMOHIKO |
分类号 |
C08K3/32;B32B15/092;C08G59/56;C08J5/24;C08L63/00;H05K1/03 |
主分类号 |
C08K3/32 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|