| 摘要 |
<p>A copper electroplating solution which contains ninhydrin and specific compounds containing sulfur atoms, with the structure -X-S-Y wherein X and Y are, independently atoms selected from a group consisting of hydrogen, carbon, sulfur, nitrogen, and oxygen, and X and Y can be the same only if they are carbon atoms and ninhydrin. By using this copper electroplating solution, it is possible to form good filled vias without worsening the appearance of the plating.</p> |
